123 Main Street • Atlanta, Georgia • 30339
Home: (555) 555-1234, Cell: (555) 555-1235
Seek the challenging and exciting position of Semiconductor Processor with a firm where my exceptional knowledge of semiconductor processing equipment and processing procedures will be fully utilized
A highly talented Semiconductor Processor with huge background in fabricating electronic devices (components), such as integrated circuits, transistors, and diodes, on semiconductor wafers, utilizing knowledge of semiconductor processing equipment and processing procedures.
Summary of Qualifications
More than five years experience.
Profound knowledge of general semiconductor processes.
Remarkable ability and experience in safely handling semiconductor processing chemicals.
Great knowledge and hands-on experience with CMP Polishers and Post CMP Cleaning equipment.
Sound knowledge and experience with copper CMP process development.
Exceptional ability to operate CMP and metrology tools.
Strong communication skills and interpersonal relationship with fellow scientists, wafer fab engineers and R &D teams.
In-depth ability to relate chemical principles to semiconductor manufacturing processes.
Profoundly self motivated and great team player.
Uncommon knowledge of statistics and SPC/SQC.
Solid computer skills with strong expertise in PC package, including word processing and data base software applications.
Strong ability to lift 5 gallon chemical pails (up to 50 lbs) and to work in a clean room environment for extended periods of time.
Vitro Electronics Inc., Tarrytown, NY 2000 - Present
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Load semiconductor material into furnace.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Scribe or separate wafers into dice.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Connect reactor to computer, using hand tools and power tools.
New York University, NY BS Degree in Material Science (2000)